05:11:14 EDT Tue 14 May 2024
Enter Symbol
or Name
USA
CA



Sato Technologies Corp
Symbol SATO
Shares Issued 72,907,680
Close 2024-03-28 C$ 0.455
Market Cap C$ 33,172,994
Recent Sedar Documents

Sato Technologies appoints Bond as director

2024-04-01 11:24 ET - News Release

Mr. Romain Nouzareth reports

SATO TECHNOLOGIES ANNOUNCES APPOINTMENT OF ANDREW BOND TO BOARD OF DIRECTORS AND DEPARTURE OF FRED PYE

Sato Technologies Corp. has appointed Andrew Bond to its board of directors, effective April 1, 2024. Mr. Bond will be replacing Fred Pye, who has chosen to step down from the company's board to focus on personal pursuits following the sale of his company 3iQ.

Mr. Bond is a Wall Street veteran with experience across capital markets, trading, equity research and banking. Mr. Bond is currently a managing director at Rosenblatt Securities where he leads the company's capital markets efforts across digital assets, mining and market structure. Prior to his time at Rosenblatt, Mr. Bond was the head of U.S. market structure at RBC Capital Markets where he was responsible for research, strategy and client engagement, leading development of RBC's policies and views with respect to markets and regulatory issues. Prior to this role, Mr. Bond was RBC's senior research analyst covering market structure, exchanges and brokers.

"We thank Fred for his contributions through our early development as a public company, and we are pleased to welcome Andrew Bond to our board," said Romain Nouzareth, chairman, chief executive officer and co-founder of Sato. "Andrew's deep financial acumen, capital markets background and strong network in the digital asset industry will be invaluable to Sato as we accelerate growth in the coming years."

About Sato Technologies Corp.

Sato, founded in 2017, is a publicly listed company providing efficient computing power. The company currently operates one centre tailored to provide computing power for bitcoin mining, but may look to expand or add additional centres for computing power for bitcoin mining, high-power computing (HPC), artificial intelligence (AI) and Layer 2s.

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