Mr. Cliff Morton reports

INTRINSYC ANNOUNCES IMMEDIATE AVAILABILITY OF PREMIUM-TIER SYSTEM ON MODULE BASED ON QUALCOMM TECHNOLOGIES' SDA835

Intrinsyc Technologies Corp. has noted the availability of the Open-Q 835 microSOM (microsystem on module) and development kit.

Intrinsyc's Open-Q 835 microSOM is an ultracompact (50 millimetres by 25 millimetres) production-ready embedded computing module that is ideal for powering premium-performance IoT devices. It is powered by the Qualcomm SDA835 system on chip (SoC) from Qualcomm Technologies Inc.

"Intrinsyc's Open-Q 835 microSOM is Intrinsyc's most advanced embedded computing module, enabling the highest combination of computing performance, thermal efficiency and power optimization," said Cliff Morton, vice-president, solutions engineering, Intrinsyc. "Next-generation premium-tier IoT [Internet of things] devices, like VR/AR [virtual reality/augmented reality] head-mounted displays, IP [Internet protocol] cameras, enterprise tablets, medical imaging systems and other devices will benefit from this high performance, production-ready computing module."

"We are happy to see Intrinsyc's new microSOM product powered by Qualcomm Technologies' SDA835," said Jeffery Torrance, vice-president, business development, Qualcomm Technologies. "Qualcomm Technologies is driving the Internet of things forward with offering the best-possible connectivity solutions, and we are proud to enable a bright future of IoT devices along with Intrinsyc."

Open-Q 835 microSOM specifications:

• Qualcomm Snapdragon 835 (APQ8098) mobile platform SoC processors:
  • Qualcomm Kryo 280 octa-core 64-bit ARM v8-compliant CPU;
  • Qualcomm Adreno 540 GPU;
  • Qualcomm Hexagon DSP with hexagon vector extensions;
• System memory: 4GB LPDDR4x RAM (POP) plus 32GB UFS flash storage;
• Wireless connectivity: Wi-Fi 802.11a/b/g/n/ac 2.4/5Ghz 2x2 MU-MIMO plus Bluetooth 5.x;
• Display interfaces:
  • HDMI 2.0a -- 4K UHD at 60fps;
  • VESA DSC 1.1 DisplayPort through USB Type C;
  • Two MIPI four-lane DSI plus touch panel;
• Camera interfaces:
  • Three MIPI CSI camera ports;
  • Dual 14-bit Qualcomm Spectra 180 ISP -- up to 32MP single or 16MP dual cameras;
• Video performance:
  • Encode: 1080p120/4K30/4x 1080p30 -- H.264, VP8, HEVC, MPEG-4;
  • Decode: 1080p240/4K60/8x 1080p30 -- H.264, VP8, HEVC 8/10-bit, VP9, MPEG-4;
  • Concurrent: 4K30 decode plus 4K30 encode or 4K60 decode plus 1080p60 encode;
• Audio interfaces:
  • SLIMBus to support Qualcomm WCD9335 audio codec (off-SOM);
  • Multichannel I2S digital audio interface;
• I/O (input/output) interfaces:
  • One USB 3.1 Type C;
  • One USB 2.0 micro-B (UART logging);
  • One SDIO four-bit interface;
  • One PCIe interface;
  • Sensor interface -- SPI, UART, I2C to sensor DSP core;
• Power: integrated battery management on SOM;
• Size: 25 millimetres by 50 millimetres by 4.5 millimetres;
• Operating system: Android 8 Oreo.

Additional information is available on the company's website.

To help IoT device makers accelerate time to market, Intrinsyc provides the Open-Q 835 microSOM development kit as well as turnkey product development services, driver and application software development, technical support, and documentation.

Intrinsyc's Open-Q 835 microSOM development kit is a full-featured development platform, including the software tools and accessories required to immediately begin development. The development kit marries the production-ready Open-Q 835 microSOM with a carrier board providing numerous expansion and connectivity options to support the development and testing of a wide variety of peripherals and applications, ensuring the fastest time to market possible. The development kit is available for purchase on Intrinsyc's website.

Contact Intrinsyc at sales@intrinsyc.com with your product requirements and have one of the company's solution architects help plan for your successful product development and launch.

About Intrinsyc Technologies Corp.

Intrinsyc provides comprehensive product development services as well as the industry's highest-performance production-ready computing modules to enable rapid commercialization of embedded and Internet of things (IoT) products. Intrinsyc has successfully delivered over 1,300 client projects, including sophisticated consumer and industrial IoT products such as robotics, connected cameras, smart displays, augmented reality, smart buildings, wearables, in-vehicle infotainment and many others. Intrinsyc is publicly traded and is headquartered in Vancouver, B.C., Canada; with additional product development centres in Taipei, Taiwan, and Bangalore, India.