NSX Series was selected due to its specialized die boundary
inspection and highly sensitive detection capabilities
Company Website:
http://www.rudolphtech.com
FLANDERS, N.J. -- (Business Wire)
Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a major
semiconductor foundry and a top outsourced semiconductor assembly and
test (OSAT) facility have placed multi-million dollar orders totaling
approximately $17 million for several NSX®
Series and Wafer
Scanner™ inspection systems. Several systems were shipped in the
first quarter and the remaining will ship in the second quarter. The
orders represent the increasing value of Rudolph’s flexible hardware and
software solutions to meet the demanding wafer-level packaging
applications semiconductor manufacturers are facing today.
The foundry customer will use the NSX systems for a rigorous
application—high-volume inspection of the die boundary area on identity
sensor devices. The OSAT will use the NSX and Wafer Scanner systems for
2D/3D defect and bump inspection and edge die chipping detection in the
ramp of new copper (Cu) pillar bumping and
wafer-level-chip-scale-packaging (WLCSP) lines for smartphone and
automobile applications.
“We are pleased customers recognize our unique value proposition and
selected Rudolph in a very competitive macro inspection market,” stated
Mike Plisinski, executive vice president and chief operating officer of
Rudolph. “By working closely with industry leaders, we will continue to
increase our capabilities leveraging all of Rudolph’s core technologies
to provide comprehensive and cost-effective solutions to our customers.”
“Our foundry customer found the inspection of die boundaries on identity
sensor devices, specifically in the street/kerf region, to be a novel
challenge due to the varying test structures in the street. New advanced
process materials are susceptible to defects in these areas, which were
previously not of concern,” stated Mike Goodrich, vice president and
general manager of Rudolph’s Inspection Business Unit. “This particular
application involves reconstructed wafers that have unique types of
defects that are difficult to distinguish from nuisance defects. Our NSX
system offers advanced detection algorithms that were able to control
this new region of yield concern at the high throughput levels required
by the customer.”
Goodrich added, “Our OSAT customer was looking to ramp their Cu pillar
bump line fast and has come to rely on Rudolph for fully-automated
inspection to reduce operation costs, enhance bumping and sawing quality
and improve yield. At the customer’s request, we will also initiate an
evaluation of our automatic defect and classification (ADC) software to
further demonstrate process control yield improvement.”
The NSX family is the market leader for automated macro defect
inspection for advanced packaging. The NSX system’s unique image
processing technique was critical for the challenging kerf inspection
application, where a traditional die-to-die comparison would not
suffice. The Wafer Scanner Series provides three-dimensional (3D)
inspection and bump height metrology required throughout post-fab
processes for both standard and flip chip wafers.
For more information about Rudolph’s NSX Series and Wafer Scanner
Inspection System, please visit www.rudolphtech.com.
About Rudolph Technologies
Rudolph Technologies, Inc. is a
leader in the design, development, manufacture and support of defect
inspection, advanced packaging lithography, process control metrology,
and data analysis systems and software used by semiconductor device
manufacturers worldwide. Rudolph provides a full-fab solution through
its families of proprietary products that provide critical
yield-enhancing information, enabling microelectronic device
manufacturers to drive down the costs and time to market of their
products. The Company’s expanding portfolio of equipment and software
solutions is used in both the wafer processing and final manufacturing
of ICs, and in adjacent markets such as FPD, LED and Solar.
Headquartered in Flanders, New Jersey, Rudolph supports its customers
with a worldwide sales and service organization. Additional information
can be found on the Company’s website at www.rudolphtech.com.
Safe Harbor Statement
This press release contains
forward-looking statements within the meaning of the Private Securities
Litigation Reform Act of 1995 (the “Act”) which include the benefits to
customers of Rudolph’s products, Rudolph’s business momentum and future
growth, Rudolph’s existing market position and its ability to maintain
and advance such position relative to its competitors and Rudolph’s
ability to meet the expectations and needs of our customers as well as
other matters that are not purely historical data. Rudolph wishes to
take advantage of the “safe harbor” provided for by the Act and cautions
that actual results may differ materially from those projected as a
result of various factors, including risks and uncertainties, many of
which are beyond Rudolph’s control. Such factors include, but are not
limited to, delays in shipping products for technical performance,
component supply or other reasons, the company’s ability to leverage its
resources to improve its positions in its core markets and fluctuations
in customer capital spending. Additional information and considerations
regarding the risks faced by Rudolph are available in Rudolph’s Form
10-K report for the year ended December 31, 2014 and other filings with
the Securities and Exchange Commission. As the forward-looking
statements are based on Rudolph’s current expectations, the company
cannot guarantee any related future results, levels of activity,
performance or achievements. Rudolph does not assume any obligation to
update the forward-looking information contained in this press release.
Contacts:
Rudolph Contacts:
Investors:
Steven R. Roth,
973-448-4302
steven.roth@rudolphtech.com
or
Guerrant
Associates
Laura Guerrant-Oiye, 808-882-1467
Principal
lguerrant@guerrantir.com
or
Trade
Press:
Amy Shay, 952-259-1794
amy.shay@rudolphtech.com
Source: Rudolph Technologies, Inc.
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